- Load-Lock chamber pumped with a CTI-8F cryogenic pump. Includes substrate pre-heat.
- Process chamber pumped with a CTI-8 cryo pump
- Mechanical vacuum pump for process chamber and Load-lock roughing.
- Tooling: Continuous pallet loading In and Out. Up to 12” substrate.
- Three “Inset” cathode assemblies.
- Upgraded AE MDX10, 10kW DC Magnetron power supply switched between targets.
- Etch/clean: RF etch station located in main process chamber.
- Includes upgraded ENI ACG-10B RF Generator.
- Control system: OEM computer control system for automatic sequencing.